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Format 記事・論文

合金としてのウィスカ抑制Pbフリーはんだ

林田 喜任,高橋 義之,大野 隆生 他

details

Title 合金としてのウィスカ抑制Pbフリーはんだ
Author 林田 喜任
Author 高橋 義之
Author 大野 隆生 他
Place of Publication (Country Code) JP
Year of Publication(W3CDTF) 2006-03
Subject Heading(Keyword) whisker growth
Subject Heading(Keyword) whisker growth restraint
Subject Heading(Keyword) whisker growth mechanism
Subject Heading(Keyword) lead-free solder
Subject Heading(Keyword) solder paste
Subject Heading(Keyword) high-temperature humidity test
Subject Heading(Keyword) tin oxidation
Subject Heading(Keyword) zinc addition
NDLC ZP41
Target Audience 一般
Material Type 記事・論文
is part of (URI Form) https://iss.ndl.go.jp/books/R100000002-I000000018323-00
is part of (ISSN Form) 00214876
is part of (ISSN-L Form) 00214876
Magazine-which-carries-the-article name 日本金属学会誌 = The journal of the Japan Institute of Metals and Materials
Printing volume 70
Printing number 3
Printing page 220~225
Language(ISO639-2 Form) jpn : 日本語

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