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Format 記事・論文


林田 喜任,高橋 義之,大野 隆生 他


Title 合金としてのウィスカ抑制Pbフリーはんだ
Author 林田 喜任
Author 高橋 義之
Author 大野 隆生 他
Place of Publication (Country Code) JP
Year of Publication(W3CDTF) 2006-03
Subject Heading(Keyword) whisker growth
Subject Heading(Keyword) whisker growth restraint
Subject Heading(Keyword) whisker growth mechanism
Subject Heading(Keyword) lead-free solder
Subject Heading(Keyword) solder paste
Subject Heading(Keyword) high-temperature humidity test
Subject Heading(Keyword) tin oxidation
Subject Heading(Keyword) zinc addition
Target Audience 一般
Material Type 記事・論文
is part of (URI Form)
is part of (ISSN Form) 00214876
is part of (ISSN-L Form) 00214876
Magazine-which-carries-the-article name 日本金属学会誌 = The journal of the Japan Institute of Metals and Materials
Printing volume 70
Printing number 3
Printing page 220~225
Language(ISO639-2 Form) jpn : 日本語

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