記事・論文
| Title | 小形電子部品の封止材料・技術 |
|---|---|
| Author | 宮森 茂樹 |
| Series | エレクトロニクス部品の封止材と活用テクニック<特集> |
| Place of Publication (Country Code) | JP |
| Year of Publication(W3CDTF) | 1988-05 |
| NDLC | ZM16 |
| Target Audience | 一般 |
| Material Type | 記事・論文 |
| is part of (URI Form) | https://iss.ndl.go.jp/books/R100000002-I000000007573-00 |
| is part of (ISSN Form) | 04522834 |
| is part of (ISSN-L Form) | 04522834 |
| Magazine-which-carries-the-article name | 工業材料 = Engineering materials |
| Printing volume | 36 |
| Printing number | 7 |
| Printing page | p50～55 |
| Language（ISO639-2 Form) | jpn : 日本語 |
