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Format 記事・論文


江尻 芳則,櫻井 健久,川上 裕 他


Title 高精細配線対応無電解Ni-P/Pd/Auめっき技術
Author 江尻 芳則
Author 櫻井 健久
Author 川上 裕 他
Place of Publication (Country Code) JP
Parallel Title Electroless Ni-P/Pd/Au plating for high density semiconductor package substrates
Year of Publication(W3CDTF) 2008-09
Target Audience 一般
Material Type 記事・論文
is part of (URI Form)
Magazine-which-carries-the-article name マイクロエレクトロニクスシンポジウム論文集 / エレクトロニクス実装学会 [編]
Printing volume 18
Printing page 111~114
Language(ISO639-2 Form) jpn : 日本語

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