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Spin-functional MOSFETs for integrated electronics ((社)日本磁気学会第168回研究会 第26回スピンエレクトロニクス専門研究会 スピン流とデバイス応用)

Spin-functional MOSFETs for integrated electronics ((社)日本磁気学会第168回研究会 第26回スピンエレクトロニクス専門研究会 スピン流とデバイス応用)
紙記事
菅原 聡<Z43-594>社団法人日本磁気学会研究会資料 = Bulletin of Topical Symposium of the Magnetics Society of Japan168 2009.11.2p.13～15
国立国会図書館全国の図書館

Polymer nanocomposite materials : applications in integrated electronic devices

Polymer nanocomposite materials : applications in integrated electronic devices
紙図書
edited by Ye Zhou, Guanglong DingWiley-VCH[2021]<PA431-D72>
国立国会図書館全国の図書館
  • 内容細目...composites for Electronics / Wei Wu Polymer Nanocomposit...

デバイス内蔵基板実装技術の最新動向 (特集 Heterogeneous Integration)

デバイス内蔵基板実装技術の最新動向 (特集 Heterogeneous Integration)
紙デジタル記事
土門 孝彰<Z74-B258>エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging20(6)=138:2017.9p.407-412
国立国会図書館全国の図書館
  • 並列タイトル等（連結）Latest Trend of Electronics Packaging Technology for Printed Circuit Board with Integrated Devices
  • 並列タイトル等Latest Trend of Electronics Packaging Technology for Printed Circuit Board with Integrated Devices

Photoelectron spectroscopy : bulk and surface electronic structures Second edition (Springer series in surface sciences ; volume 72)

Photoelectron spectroscopy : bulk and surface electronic structures Second edition (Springer series in surface sciences ; volume 72)
紙図書
Shigemasa Suga, Akira Sekiyama, Christian TuscheSpringer[2021]<MC93-D5>
国立国会図書館
  • 内容細目...mples of Angle Integrated Photoelectron ......ft X-ray Angle-Integrated and -Resolved Photoelectron S...

Fiber electronics

Fiber electronics
紙図書
Huisheng PengSpringer[2020]<ND351-D20>
国立国会図書館全国の図書館
  • 要約等...ances in fiber electronics, like fiber-shaped solar cell...
  • 内容細目...anism in Fiber Electronics Fiber Dye-Sens...... Fiber Devices Integrated Fiber Devices Packaging of Fi...
  • 件名Electronics Fibrous compos...... Fiber optics. Electronics. Chemistry. Force and energy....

Handbook of flexible organic electronics : materials, manufacturing and applications (Woodhead Publishing series in electronic and optical materials ; number 68)

Handbook of flexible organic electronics : materials, manufacturing and applications (Woodhead Publishing series in electronic and optical materials ; number 68)
紙図書
edited by Stergios Logothetidis.Woodhead Publishing[2015]<ND351-B71>
国立国会図書館全国の図書館
  • 内容細目...exible organic electronics applications O......onic materials Integrated printing for 2......ications Smart integrated systems and ci......exible organic electronics : automotive applications Che...
  • 件名Organic electronics. Electronics--Materials. Information displ...

Integrated silicon-based optical modulators : 100 Gb/s and beyond

Integrated silicon-based optical modulators : 100 Gb/s and beyond
紙図書
Kensuke OgawaSPIE Press[2019]<ND416-D13>
国立国会図書館
  • 要約等...s cutting-edge integrated photonic devices on silicon-p...
  • 内容細目Backgrounds Introduction to integrated optical modula...... waveguides in integrated Mach-Zehnder o......acteristics of integrated silicon-based ......acteristics of integrated silicon-based optical modulat...
  • 件名Light modulators Silicon--Optical properties Integrated optics

Design and analysis of distributed energy management systems : integration of EMS, EV, and ICT (Power electronics and power systems)

Design and analysis of distributed energy management systems : integration of EMS, EV, and ICT (Power electronics and power systems)
紙図書
Tatsuya Suzuki, Shinkichi Inagaki, Yoshihiko Susuki, Anh Tuan Tran, editors.Springer[2020]<ND131-D5>
国立国会図書館
  • 内容細目...agement system integrated to a vehicle(V......ices with grid-integrated electric vehicles Chapter 7. ...
  • タイトル標目Power electronics and power systems (Springer)

SMEs and economic integration in Southeast Asia

SMEs and economic integration in Southeast Asia
紙図書
edited by Cassey Lee, Dionisius Narjoko and Sothea Oum.ISEAS Yusof Ishak Institute2019.<DH141-P15>
国立国会図書館

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2015]<M17-16-1112>
国立国会図書館
  • 内容細目...v. 2. Advanced electronics and photonics,......ing ; Advanced electronics and photonics: packaging, int...

Advanced technologies for next generation integrated circuits (IET materials, circuits and devices series ; 49)

Advanced technologies for next generation integrated circuits (IET materials, circuits and devices series ; 49)
紙図書
edited by Ashok Srivastava and Saraju P. MohantyThe Institution of Engineering and Technology2020<ND351-D22>
国立国会図書館
  • 件名Interconnects (Integrated circuit technology)

Fast road sign recognition by integral image and DP matching (Space, aeronautical and navigational electronics)

Fast road sign recognition by integral image and DP matching (Space, aeronautical and navigational electronics)
紙記事
Yuta Aoki, Katsuto Nakajima<Z16-940>電子情報通信学会技術研究報告 = IEICE technical report : 信学技報110(250) 2010.10.27-29p.53～58
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A switched-capacitor integrator using dynamic source-follower amplifiers (Electron devices)

A switched-capacitor integrator using dynamic source-follower amplifiers (Electron devices)
紙記事
矢口 僚人, 安達 美志, 和保 孝夫<Z16-940>電子情報通信学会技術研究報告 = IEICE technical report : 信学技報110(109) 2010.6-7.30-2p.297～300
国立国会図書館

High integrity gate insulator films on atomically flat silicon surface (Electron devices)

High integrity gate insulator films on atomically flat silicon surface (Electron devices)
紙記事
X. Li, R. Kuroda, T. Suwa 他<Z16-940>電子情報通信学会技術研究報告 = IEICE technical report : 信学技報110(109) 2010.6-7.30-2p.183～188
国立国会図書館全国の図書館

Handbook of high field dynamic nuclear polarization (eMagRes books)

Handbook of high field dynamic nuclear polarization (eMagRes books)
紙図書
editors, Vladimir K. Michaelis, Robert G. Griffin, Björn Corzilius, Shimon Vega.Wiley2020.<MC261-D3>
国立国会図書館全国の図書館
  • 内容細目... hardware with integrated electron paramagnetic resonan...

Handbook of thermal plasmas (Springer Nature reference)

Handbook of thermal plasmas (Springer Nature reference)
紙図書
Maher I. Boulos, Pierre L. Fauchais, Emil Pfender, editorsSpringer[2023]<MC241-D7>
国立国会図書館
  • 内容細目...pts in Gaseous Electronics Thermodynamic Properties of P...

3-5/Ge CMOS technologies and heterogeneous integrations on Si platform (Electron devices)

3-5/Ge CMOS technologies and heterogeneous integrations on Si platform (Electron devices)
紙記事
高木 信一, 竹中 充<Z16-940>電子情報通信学会技術研究報告 = IEICE technical report : 信学技報110(109) 2010.6-7.30-2p.119～124
国立国会図書館全国の図書館

Measurement of amount of generated acoustic cavitation: investigation of spatial distribution of acoustic cavitation generation using broadband integrated voltage (Special issue: Ultrasonic electronics)

Measurement of amount of generated acoustic cavitation: investigation of spatial distribution of acoustic cavitation generation using broadband integrated voltage (Special issue: Ultrasonic electronics)
紙記事
Takeyoshi Uchida, Shinichi Takeuchi, Tsuneo Kikuchi<Z53-A375>Japanese journal of applied physics : JJAP50(7) (2) 2011.7p.07HE01-1～4
国立国会図書館全国の図書館

Nickel line patterning using silicon supersonic micronozzle integrated with a nanoparticle deposition system (Special issue: Printed electronics)

Nickel line patterning using silicon supersonic micronozzle integrated with a nanoparticle deposition system (Special issue: Printed electronics)
デジタル記事
Kyubong Jung, Woojin Song, Doo-Man Chun 他<Z53-A375>Japanese journal of applied physics : JJAP49(5) (2) 2010.5p.05EC09-1～4
インターネットで読める国立国会図書館全国の図書館

Proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems--2020-- : presented at ASME 2020 international technical conference on packaging and integration of electronic and photonic microsystems : October 27-29, 2020 : online : ASME 2020 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : Oct 2020, ------.

Proceedings of the ASME international technical conference on packaging and integration of electronic and photonic microsystems--2020-- : presented at ASME 2020 international technical conference on packaging and integration of electronic and photonic microsystems : October 27-29, 2020 : online : ASME 2020 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : Oct 2020, ------.
紙図書
The American Society of Mechanical Engineers (ASME)[2020]<M17-21-768>
国立国会図書館