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IEEE Transactions on Components, Packaging, and Manufacturing Technology Pt. A

IEEE Transactions on Components, Packaging, and Manufacturing Technology Pt. A
紙記録メディア雑誌
Institute of Electrical and Electronics Engineers<Z53-V87>
国立国会図書館全国の図書館
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The effect of contact capacitance on current-voltage characteristics of stationary metal contacts

The effect of contact capacitance on current-voltage characteristics of stationary metal contacts
デジタル記事
1998-12IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 4p.530-540
全国の図書館
  • 掲載誌（ISSN）10709886

Failure analysis of bond pad metal peeling using FIB and AFM

Failure analysis of bond pad metal peeling using FIB and AFM
デジタル記事
1998-12IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 4p.585-591
全国の図書館
  • 掲載誌（ISSN）10709886

Overview of conductive adhesive interconnection technologies for LCDs

Overview of conductive adhesive interconnection technologies for LCDs
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.208-214
全国の図書館
  • 掲載誌（ISSN）10709886

Current-induced degradation of isotropically conductive adhesives

Current-induced degradation of isotropically conductive adhesives
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.259-265
全国の図書館
  • 掲載誌（ISSN）10709886

Conductive adhesive materials for lead solder replacement

Conductive adhesive materials for lead solder replacement
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.252-258
全国の図書館
  • 掲載誌（ISSN）10709886

Applicability and correction of temperature-voltage relation in the case of point contact

Applicability and correction of temperature-voltage relation in the case of point contact
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.345-351
全国の図書館
  • 掲載誌（ISSN）10709886

Underflow process for direct-chip-attachment packaging

Underflow process for direct-chip-attachment packaging
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.266-274
全国の図書館
  • 掲載誌（ISSN）10709886

Effect of arc behaviour on material transfer: a review

Effect of arc behaviour on material transfer: a review
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.310-322
全国の図書館
  • 掲載誌（ISSN）10709886

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging

Design and understanding of anisotropic conductive films (ACF's) for LCD packaging
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.226-234
全国の図書館
  • 掲載誌（ISSN）10709886

Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art

Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art
デジタル記事
1998-06IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 2p.215-225
全国の図書館
  • 掲載誌（ISSN）10709886

Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives

Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives
デジタル記事
1998-03IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 1p.23-31
全国の図書館
  • 掲載誌（ISSN）10709886

Arc motion and pressure formation in low voltage switchgear

Arc motion and pressure formation in low voltage switchgear
デジタル記事
1998-03IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 1p.33-39
全国の図書館
  • 掲載誌（ISSN）10709886

Analytical modeling of spreading resistance in flux tubes, half spaces, and compound disks

Analytical modeling of spreading resistance in flux tubes, half spaces, and compound disks
デジタル記事
1998-03IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 1p.168-176
全国の図書館
  • 掲載誌（ISSN）10709886

Simulation of the gasdynamic and electromagnetic processes in low voltage switching arcs

Simulation of the gasdynamic and electromagnetic processes in low voltage switching arcs
デジタル記事
1998-03IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 1p.96-103
全国の図書館
  • 掲載誌（ISSN）10709886

Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation

Characterization of self-heating in advanced VLSI interconnect lines based on thermal finite element simulation
デジタル記事
1998IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 3p.406-411
全国の図書館
  • 掲載誌（ISSN）10709886

High performance no-flow underfills for low-cost flip-chip applications: material characterization

High performance no-flow underfills for low-cost flip-chip applications: material characterization
デジタル記事
1998IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 3p.450-458
全国の図書館
  • 掲載誌（ISSN）10709886

Development of large-area BaTi0/sub 3/ ceramics with optimized depletion regions as dielectrics for planar power electronics

Development of large-area BaTi0/sub 3/ ceramics with optimized depletion regions as dielectrics for planar power electronics
デジタル記事
1998IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A21 3p.492-499
全国の図書館
  • 掲載誌（ISSN）10709886

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading
記事
1997-09IEEE Transactions on Components Packaging and Manufacturing Technology Part A20 3p.266-273
全国の図書館
  • 掲載誌（ISSN）10709886

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading

Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading
デジタル記事
Yu, Qiang, Shiratori, M.Institute of Electrical and Electronics Engineers1997-09IEEE Transactions on Components Packaging and Manufacturing Technology Part A20 3p.266-273
全国の図書館