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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

IEEE Transactions on Components, Hybrids, and Manufacturing Technology
紙雑誌
Institute of Electrical and Electronics Engineers<Z53-V87>
国立国会図書館全国の図書館
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Sliding contact characteristics between self-lubricating composite materials and copper

Sliding contact characteristics between self-lubricating composite materials and copper
デジタル記事
1993-06IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 4p.442-448
全国の図書館
  • 掲載誌（ISSN）01486411

A numerical model for thermal processes in an electrode submitted to an arc in air and its experimental verification

A numerical model for thermal processes in an electrode submitted to an arc in air and its experimental verification
デジタル記事
1993-06IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 4p.449-455
全国の図書館
  • 掲載誌（ISSN）01486411

Formation of SiO/sub 2/ on contact surface and its effect on contact reliability

Formation of SiO/sub 2/ on contact surface and its effect on contact reliability
デジタル記事
1993-06IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 4p.437-441
全国の図書館
  • 掲載誌（ISSN）01486411

Constriction resistance of conducting spots by the boundary element method

Constriction resistance of conducting spots by the boundary element method
デジタル記事
1993-05IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 3p.339-343
全国の図書館
  • 掲載誌（ISSN）01486411

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn

Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn
デジタル記事
1993-05IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 3p.323-332
全国の図書館
  • 掲載誌（ISSN）01486411

Au-In bonding below the eutectic temperature

Au-In bonding below the eutectic temperature
デジタル記事
1993-05IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 3p.311-316
全国の図書館
  • 掲載誌（ISSN）01486411

Capacitance of disk capacitors

Capacitance of disk capacitors
デジタル記事
1993-05IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 3p.360-366
全国の図書館
  • 掲載誌（ISSN）01486411

Automated vision system for inspection of IC pads and bonds

Automated vision system for inspection of IC pads and bonds
デジタル記事
1993-05IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 3p.333-338
全国の図書館
  • 掲載誌（ISSN）01486411

Effect of an axial magnetic field upon the development of the vacuum arc between opening electric currents (currents read contacts)

Effect of an axial magnetic field upon the development of the vacuum arc between opening electric currents (currents read contacts)
デジタル記事
1993-03IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 2p.180-189
全国の図書館
  • 掲載誌（ISSN）01486411 http://id.crossref.org/issn/0...

The effects of CdO on the static gap arc erosion of silver-based contacts

The effects of CdO on the static gap arc erosion of silver-based contacts
デジタル記事
1993-03IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 2p.190-195
全国の図書館
  • 掲載誌（ISSN）01486411

Efficient computation of signal propagation delay with overshoot- and undershoot-control in VLSI interconnections

Efficient computation of signal propagation delay with overshoot- and undershoot-control in VLSI interconnections
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 1p.146-151
全国の図書館
  • 掲載誌（ISSN）01486411

200 degrees C operation of semiconductor power devices

200 degrees C operation of semiconductor power devices
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 7p.759-764
全国の図書館
  • 掲載誌（ISSN）01486411

Passivation schemes for copper/polymer thin-film interconnections used in multichip modules

Passivation schemes for copper/polymer thin-film interconnections used in multichip modules
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 1p.53-59
全国の図書館
  • 掲載誌（ISSN）01486411

A method of adhesion strength test for thick film

A method of adhesion strength test for thick film
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 6p.584-591
全国の図書館
  • 掲載誌（ISSN）01486411

Equivalent circuit modeling of interconnects from time-domain measurements

Equivalent circuit modeling of interconnects from time-domain measurements
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 1p.119-126
全国の図書館
  • 掲載誌（ISSN）01486411

A new assembly architecture for multichannel single mode-fiber-pigtail LD/PD modules

A new assembly architecture for multichannel single mode-fiber-pigtail LD/PD modules
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 1p.89-94
全国の図書館
  • 掲載誌（ISSN）01486411

A universal nonlinear component and its application to WSI

A universal nonlinear component and its application to WSI
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 7p.656-664
全国の図書館
  • 掲載誌（ISSN）01486411

Co-integration of optoelectronics and submicrometer CMOS

Co-integration of optoelectronics and submicrometer CMOS
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 7p.674-685
全国の図書館
  • 掲載誌（ISSN）01486411

Correlation of analytical and experimental approaches to determine thermally induced PWB warpage

Correlation of analytical and experimental approaches to determine thermally induced PWB warpage
デジタル記事
1993IEEE Transactions on Components, Hybrids, and Manufacturing Technology16 8p.986-995
全国の図書館
  • 掲載誌（ISSN）01486411